Foil-clad fiberglass laminate 100x100 mm for printed circuit boards

Sheet foil-clad fiberglass laminate measuring 100x100 mm is designed for independent design and manufacture of printed circuit boards using the chemical etching method. High-quality copper foil is firmly bonded to a durable fiberglass cloth base, providing excellent heat resistance and mechanical strength during soldering. The material is ideally suited for amateur radio projects, prototypes and small-batch electronic modules using laser-toner transfer or photoresist technology. Features: Product type: sheet foil-clad fiberglass laminate (Copper-Clad Laminate) Specifications: 100x100 mm dimensions, dense dielectric base, uniform copper coating Purpose: independent manufacture of printed circuit boards by chemical etching for assembling electronic devices