Copper Desoldering Braid HJ-2515 (2.5 mm x 1.5 m)

The HJ-2515 copper braid is designed for neat removal of excess solder and desoldering of electronic components from printed circuit boards. The braided tape, 2.5 mm wide, readily absorbs molten solder when heated with a soldering iron; the width suits both fine SMD contacts and DIP component leads. The tape on the spool is 1.5 m long. Low Residual flux impregnation minimizes board contamination after use. Complies with the RoHS standard. Features: Product type: desoldering braid / soldering wick (Soldering Wick / Desoldering Braid) Specifications: model HJ-2515, width 2.5 mm, length 1.5 m, low flux residue (Low Residual), RoHS Purpose: removing excess solder, dismantling electronic components and cleaning contact pads